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Kontron CompatPCI CP3004-SA: Bringing performance and reliability to demanding environments

Augsburg, Germany, November 23 - Kontron, a leading global provider of Embedded Computer Technology (ECT) announces its latest addition to the CompactPCI CPU Board Family, the CP3004-SA. The CP3004-SA is a 3 U blade based on the 5th Gen Intel® Core™ i7 processor and the 4th Gen Intel® Core™ i5 and i3 processors.  The dual core versions provide for low heat dissipation. Moreover, all cores have the capability for dynamic adjustment of the thermal design power (TDP), to maintain a temperature limit needed in certain environments. These cores alone provide increased performance-per-watt, enhanced and accelerated floating point calculation and high-end graphics.

The CompactPCI modular form factor is popular in Industrial Automation for plant and machine control, Military & Defense for a wide variety of systems, and Energy for coal, oil and gas applications.  Suitable for all markets, CompactPCI is designed for higher reliability and long term programs, as well as demanding environments. Feature highlights of the CP3004-SA include USB3.0, SATA6Gb/s, 3xGbE, PCIe, and security/trusted platform module (TPM- option). Additionally, the Kontron CP3004 has a variety of optional extensions including Smart Extension (USB, SATA), SATA NAND Flash Module, CFast, 8/12HP for 1 or 2 HDD, and 8HP extension for XMC.

About Kontron
Kontron, a global leader in embedded computing technology and trusted advisor in IoT, works closely with its customers, allowing them to focus on their core competencies by offering a complete and integrated portfolio of hardware, software and services designed to help them make the most of their applications.

With a significant percentage of employees in research and development, Kontron creates many of the standards that drive the world’s embedded computing platforms; bringing to life numerous technologies and applications that touch millions of lives. The result is an accelerated time-to-market, reduced total-cost-of-ownership, product longevity and the best possible overall application with leading-edge, highest reliability embedded technology.             


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